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  1 features description/ordering information ts321-q1 www.ti.com ................................................................................................................................................................................................ slos647 ? august 2009 low-power single operational amplifier qualified for automotive applications wide power-supply range ? single supply: 3 v to 30 v ? dual supply: 1.5 v to 15 v large output voltage swing: 0 v to 3.5 v (min) (v cc = 5 v) low supply current: 500 m a (typ) low input bias current: 20 na (typ) stable with high capacitive loads the ts321 is a bipolar operational amplifier for cost-sensitive applications in which space savings are important. ordering information (1) t a package (2) orderable part number top-side marking ? 40 c to 125 c sot-23-5 ? dbv reel of 3000 ts321qdbvrq1 9cns (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2009, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. dbv (sot-23-5) package (top view) 1 2 5 out v cc+ 3 4 in+ inC v ccC
ts321-q1 slos647 ? august 2009 ................................................................................................................................................................................................ www.ti.com schematic diagram 2 submit documentation feedback copyright ? 2009, texas instruments incorporated product folder link(s): ts321-q1 v cc in? in+ out
absolute maximum ratings (1) recommended operating conditions ts321-q1 www.ti.com ................................................................................................................................................................................................ slos647 ? august 2009 over operating free-air temperature range (unless otherwise noted) min max unit single 32 v cc supply voltage (2) v dual 16 v id differential input voltage (3) 32 v v i input voltage range (2) (4) ? 0.3 32 v i i input current (4) 50 ma t short duration of output short circuit to ground unlimited q ja package thermal impedance, junction to free air (5) (6) dbv package 206 c/w t j operating virtual junction temperature 150 c t stg storage temperature range ? 65 150 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) these voltage values are with respect to the midpoint between v cc+ and v cc ? . (3) differential voltages are at in+ with respect to in ? . (4) neither input must ever be more positive than v cc+ or more negative than v cc ? . (5) maximum power dissipation is a function of t j (max), q ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ q ja . selecting the maximum of 150 c can affect reliability. (6) the package thermal impedance is calculated in accordance with jesd 51-7. min max unit single supply 3 30 v cc supply voltage v dual supply 1.5 15 t a operating free-air temperature ? 40 125 c copyright ? 2009, texas instruments incorporated submit documentation feedback 3 product folder link(s): ts321-q1
electrical characteristics ts321-q1 slos647 ? august 2009 ................................................................................................................................................................................................ www.ti.com v cc+ = 5 v, v cc ? = gnd, v o = 1.4 v (unless otherwise noted) parameter test conditions t a min typ max unit 25 c 0.5 4 r s = 0, 5 v < v cc+ < 30 v, v io input offset voltage mv 0 < v ic < (v cc+ ? 1.5 v) full range 5 25 c 2 30 i io input offset current na full range 50 25 c 20 150 i ib input bias current (1) na full range 200 25 c 50 100 large-signal differential voltage v cc = 15 v, r l = 2 k ? , a vd v/mv amplification v o = 1.4 v to 11.4 v full range 25 25 c 0 v cc+ ? 1.5 v icr common-mode input voltage (2) v cc = 30 v v full range 0 v cc+ ? 2 25 c 26 27 r l = 2 k ? full range 25.5 v cc = 30 v 25 c 27 28 v oh high-level output voltage r l = 10 k ? v full range 26.5 25 c 3.5 v cc = 5 v r l = 2 k ? full range 3 25 c 5 15 v ol low-level output voltage r l = 10 k ? mv full range 20 v cc = 30 v, v i = 10 mv, r l = 2 k ? , gbp gain bandwidth product 25 c 0.8 mhz f = 100 khz, c l = 100 pf v cc = 15 v, v i = 0.5 v to 3 v, sr slew rate 25 c 0.4 v/ m s r l = 2 k ? , c l = 100 pf, unity gain f m phase margin 25 c 60 cmrr common-mode rejection ratio r s 10 k ? 25 c 65 85 db i source output source current v cc = 15 v, v o = 2 v, v id = 1 v 25 c 20 40 ma v o = 2 v 25 c 10 20 ma i sink output sink current v cc = 15 v, v id = 1 v v o = 0.2 v 25 c 12 50 m a i o short-circuit to gnd v cc = 15 v 25 c 40 60 ma svr supply-voltage rejection ratio v cc = 5 v to 30 v 25 c 65 110 db v cc = 5 v 500 800 25 c v cc = 30 v 600 900 i cc total supply current no load m a v cc = 5 v 600 900 full range v cc = 30 v 1000 v cc = 30 v, v o = 2 v pp , a v = 20 db, thd total harmonic distortion 25 c 0.015 % r l = 2 k ? , f = 1 khz, c l = 100 pf e n equivalent input noise voltage v cc = 30 v, f = 1 khz, r s = 100 ? 25 c 50 nv/ hz (1) the direction of the input current is out of the device. this current essentially is constant, independent of the state of the output, so no loading change exists on the input lines. (2) the input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 v. the upper end of the common-mode voltage range is v cc+ ? 1.5 v, but either or both inputs can go to 32 v without damage. 4 submit documentation feedback copyright ? 2009, texas instruments incorporated product folder link(s): ts321-q1
package option addendum www.ti.com 11-apr-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) top-side markings (4) samples ts321qdbvrq1 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 9cns (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) multiple top-side markings will be inside parentheses. only one top-side marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire top-side marking for that device. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of ts321-q1 : ? catalog: ts321
package option addendum www.ti.com 11-apr-2013 addendum-page 2 note: qualified version definitions: ? catalog - ti's standard catalog product
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant ts321qdbvrq1 sot-23 dbv 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 q3 package materials information www.ti.com 14-mar-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) ts321qdbvrq1 sot-23 dbv 5 3000 202.0 201.0 28.0 package materials information www.ti.com 14-mar-2013 pack materials-page 2


important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? 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